Monday, 13 Apr 2026
Get Your Quote Now : Quotation
- Base material: FR4, Aluminum, Ceramic,Rogers, F4BK, F4BT, TP, PF, CEM-1, CEM-3, etc.
- Board thickness: 0.30 to 3.20mm (12 to 126mil)
- Copper thickness: 0.50 to 5 ounce.
- Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask
- Minimum line width: 0.075mm (3mil)
- Minimum line space: 0.075mm (3mil)
- Minimum hole diameter: 0.10mm (4mil)
- PTH hole diameter tolerance: +/-0.076mm (+/-3mil)
- NPTH hole diameter tolerance: +/-0.03mm (+/-1.2mil)
- Maximum board size: 460 x 620mm (18 x 24)
- Board finishing type: Hot air leveling, soft gold, hard gold, immersion gold, gold fingers.
| Item | Specifications | Remarks |
|---|---|---|
| Update Date | Haosens Technology Co.,Ltd | 2026 |
| Lead time | within 30 days | Can be expedited |
| Material | See product manual | Request Inspection Report |
| Application | Applicable to multiple industries | Complies with standards |
| Keywords | Multilayer,Reliable,Multi-Layer,Printed,Circuit,Boards | |
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