Atmospheric Plasma Cleaning System Chain Conveyor
Applicable scenarios:1. Pre-treatment of gold plating to improve uniformity.2. Before copper plating, it is used to improve thin plating and leaking plating.3. Before HDI/PTH copper plating, it is used to solve problems such as leaking plating and color difference, and improve uniformity.4. Before gold plating, solve problems such as thin plating, leaking plating, whitening of gold surface, and gold penetration.5. PI board processing to enhance bonding.6. Before soft board reinforcement, enhance bonding.7. Solder mask and text processing to solve problems such as plugging holes, bursting holes, and peeling.
Principles of Plasma Cleaning1. Etching on the Material Surface - Physical EffectThe large number of ions, excited molecules, free radicals and other active particles in the plasma act on the surface of solid samples, not only removing the original pollutants and impurities on the surface, but also producing etching effects, making the sample surface rough, forming many fine pits, and increasing the specific surface area of ??the sample. Improve the wetting properties of the solid surface.2. Activate bond energy and cross-linkingThe particle energy in the plasma is 0~20eV, while most of the bond energies in the polymer are 0~10eV. Therefore, after the plasma acts on the solid surface, the original chemical bonds on the solid surface can be broken, and the free radicals in the plasma form a network cross-linking structure with these bonds, which greatly activates the surface activity.3. Formation of new functional groups - chemical reactionIf reactive gas is introduced into the discharge gas, complex chemical reactions will occur on the surface of the activated material, introducing new functional groups, such as hydrocarbon groups, amino groups, carboxyl groups, etc. These functional groups are active groups and can significantly increase the surface activity of the material.
Advantages of low-temperature plasma cleaningPlasma cleaning, as an important material surface modification method, has been widely used in many fields.Compared with some traditional cleaning methods, such as ultrasonic cleaning, UV cleaning, etc., it has the following advantages:1. Low processing temperatureThe processing temperature can be as low as 80℃, 50℃ or below. The low processing temperature can ensure that there is no thermal impact on the sample surface.2. No pollution during the entire treatment processThe plasma cleaning machine itself is a very environmentally friendly equipment, which does not produce any pollution, and the treatment process does not produce any pollution.It can be matched with the original production line to achieve fully automatic online production and save labor costs.3. Stable treatment effectThe treatment effect of plasma cleaning is very uniform and stable, and the effect is maintained for a long time after conventional sample treatment.4. It can be perfectly matched with the automated assembly line to improve production efficiencyAccording to the user's on-site needs, the optimal assembly line production plan is configured to greatly improve production efficiency.
Product advantages:1. Significantly improve surface hydrophilicity and enhance bonding2. Remove surface oil, fingerprints and other organic contamination horizontally3. Board walking speed 2~5 meters/minute4. Double-sided processing is possible, and equipment can be customized according to production capacity5. Processing under atmospheric pressure, no special gas is required, and installation and use are simple
Product Specifications:1.Dimensions L*W*H:1200*1150*1150（1500）mm2.Power supply Single-phase 220V, 50/60HZ, 12A3.Conveying method Roller conveyor, chain conveyor, belt conveyor4.Working environment Temperature: -10℃~40℃, relative humidity: 50%~93% (non-condensing)5.Plasma generator 500-700W adjustable; optional 700-1200W (high power version)High power version is suitable for 50mm and 70mm spray guns @25-40KHz6.Working gas Water-free and oil-free compressed air; optional argon, nitrogen, etc.7.Effective processing width Width 500mm, double-sided processing (optional), the number of rotating nozzles is optional8.Rotating spray gun Processing width diameter: 50mm, optional 70, 30, 20mm9.Support plate thickness < 3mm (special specifications of thick plates require special customization of the equipment)10.Processing speed 2.0m/min ~ 5.0m/min11.Cooling method Air cooling, factory exhaust > 400m3/h12.Control system PLC+HMI
Merits:Environmentally friendly molecular-level surface cleaning enhances uniformity and hydrophilicity, making it an ideal pre-treatment for bonding processes.
Application fields:
Suitable for PCBs, IC substrates, LEDs, LCDs, PV batteries, semiconductors, PTFE, automotive interior parts, medical equipment, plastic and rubber products.
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