Computerised Bga Rework Station DH-G600

Power(Max)

Main Features

1) Embedded with Industrial PC + Intelligent temperature module, Stable and  reliable.

2) Windows OS interface in English and Chinese + USB interface, easy operate. 

3) With 5 different size of nozzles: upper: 31*31 mm, 38*38 mm,41*41 mm.  Bottom: 34*34 mm 55*55 mm . 

4) Any size of nozzle can be custom , Titanium alloy material, never deformed , never rusty.

5) Adopt three heating zones, upper heater and lower heater are hot air, bottom is  infrared preheating zone.

6)High power cross flow fan,making the pcb board cooled fast, prevent it from deformed.

Accurate temperature control:

1)Three independent heaters + PID self setting adjusted + PLC control to ensure temperature accuracy will be on ±1°C.

2)It can set 8 segments heating, and massive storage of groups temperature profile.

3)Setting BGA heating curve conveniently and index search.

4)Automatic temperature curve analysis.

Convenient visual alignment: 

1)Optical alignment system + CCD color lens system.

2)2 color separation, magnification, micro adjustment.

3)Auto focus, auto correction, auto color differentiation.

4)Light brightness adjustment system.

5)Japan japanese camera camera can move frontward and backward.

6)Built-in vacuum sucker, pick up the bga chip conveniently after desoldering.

Precision components:

1)Precise fine-tuning knob of bge chip, adjust angle of bga chip to alignment.

2)X, Y , Z micrometers fine-tuning, Placement accuracy will be ±0.01 mm.

3)V-groove clamp + universal fixture suitable for all kinds of PCB.

4)Hot air nozzle with magnet, rotate in any angle, easy replace and operate.

5)Heating system and placement head 2 in 1 design, precise positioning.

6)Top air flow speed adjusted function, prevent tiny bga from be moved when heating.

Perfect security design:

1)With fan failure protection, thermocouple failure protection function.

2)Overheating protection, emergency stop function.

3)Start up password and modify protection.

Application: 

Suited for all kinds of BGA repairing (CCGA、BGA、QFN、 CSP、LGA、Micro SMD、MLF...) Lead and Lead-free

II. Parameters