RS6000-Pad20 Gap-Filler Pads allow you to not only retain the thermal performance, but also give you a leeway to customize your pad shapes. You may include additional punch holes at 2.0W/m.K, and you may tailor the pads to the satisfactory level as long as the design drawings are provided.
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Features: soft and highly compliant, self-adhesive, easy-to-apply.
Applications: electro-optical and radar sensors, navigation systems, inertial sensors, GNSS and robotics, speed sensors, displays, embedded computers, power control & conditioning systems, RF & microwave products, networking and telecommunications, notebooks, tablets, power conversion, SSD, NVMe, VAM, VRAM, heat sink, EMS, ITM, MCU.
SPECIFICATION
Attribute | Value | Test Method |
Composition | Ceramic Filler + Silicone | - |
Color | Grey | Visual |
Thickness（mm） | 0.7-12.0 | ASTM D374 |
Density (g/cc) | 2.82 | ASTM D792 |
Hardness (shore oo) | 25 (Thickness ≤ 1.0 Shore OO 35) | ASTM D2240 |
Usage Temperature (C) | -40~+150 | - |
Electrical |
Breakdown Voltage (kV/mm) | >6.0 | ASTM D149 |
Dielectric Constant @1MHz | 7.0 | ASTM D150 |
Volume Resistivity (Ω.cm) | 10^13 | ASTM D257 |
Flammability | V-0 | UL 94 |
Thermal |
Thermal Conductivity (W/m.K) | 2.0 | ASTM D5470 |
* OEM: thermal pads are available in sheets or cut parts to match a wide range of industry standard or customer defined outlines.
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Thermal Pad Manufacturer（TPHI）
Standard Sheet Size
200x400mm or custom die cut parts.
Thickness available in 0.25mm increments.
Storage
Store in a cool, dry, well-ventilated place.
Shelf life
Shelf life of the product is 12 months after date of shipment.
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