I.Function ：
1. Automatic picking, automatic feeding, automatic alignment, automatic mounting, automaticdisassembly, automatic welding, and automatic completion of repair;
2. Excellent positioning system, quickly and automatically identifying Mark points, achievingprecise positioning of BGA removal and installation operations;
3. The three temperature zones are independently controlled and can be combined arbitrarily.The preheating zone can adjust the heating area according to the size of the PCB board;
4. Integrated design of disassembly and tin removal device, easy to handle SMT/THT processrepair;
5. It can be connected to nitrogen for heating protection of PCBA to avoid oxidation andyellowing, and the flow and negative pressure can be accurately adjusted;
6. Side monitoring system, real-time observation of tin melting status during tin removaland welding;
7. Equipped with dual overtemperature protection and alarm functions to prevent product damagedue to temperature abnormalities;
8. Separate management and operation permissions to prevent arbitrary modification ofparameter settings by humans;
9. Can interface with MES/SAP system;
10. Suitable for various chip repairs (POP, SOP, SOJ, QFP, QFN, BGA, PLCC, SCP...)
II: Parameters
power: AC380V±10％ 50/60Hz
Total Power: Max 24500W
Top heater: 1500W
Lower heater: 1500W
Bottom heater: 18900W（German heating tube, heating area620×950mm）
Operation mode: Disassembly, welding, suction, and pasting are integrated andautomatically completed! The head and lower temperature zonecan freely move forward, backward, left, and right along theX and Y axes to meet the different position distribution ofBGA chips on the PCB.
Basic configuration: Automatic material delivery system+high-definition digitalcamera+Japanese Mismi suction rod system+Panasonic CCDoptical alignment system+high-definition digital displayPC+upper computer+Panasonic servo+Panasonic PLC+grindinggrade guide rail (Taiwan Shangyin)+Dalian University ofTechnology 10 channel temperature control system+AmericanOmega temperature measurement system+high thermal efficiencyheating brick
Dimensions: L2060×W1760×H2200 mm
Chip feeding system: Automatic feeding, feeding, automatic sensing (optional)
Temperature profilestorage: 50000 groups
Optical CCD lens: Automatic extension and retraction, which can be freely movedforward, backward, left, and right through program control,eliminating the problem of "observation dead angles"
IR area: 620×950mm
Chip angel adjust: Φ The angle can be rotated 360 °, and the mounting nozzlecan be precisely adjusted
Positioning: Intelligent positioning up and down, with a "5-point support"at the bottom and a V-shaped card slot to fix the PCBA. ThePCBA can be adjusted freely in the X direction, and is equippedwith a universal fixture externally
BGA position: Laser positioning to quickly locate the vertical pointsbetween the upper and lower temperature zones and the centerof BGA
Temperature control: K-type thermocouple (K Sensor)+closed loop control (Closedloop)+8-20 segment temperature control programming
Temp accuracy: ±1degree
Placement Accuracy: +/-0.01mmCCD systemCCD high-definition digital camera, 20 million pixels,automatic optical zoom, laser positioning
Pressure sensor: Sensing pressure greater than 10-30G (configurable) willactivate collision and pressure protection
Safety guard Electronic pressure sensing protection: Travel of upper and lowertemperature zonesX-axis 900mm, Y-axis 600mm
PCB size: Max 940×736mm Min 10×10mm
PCB thickness: 0.2-15MM
BGA chip: 2×2-120×120mm
Gas source: External air source+air source filtration system
Gas mold: Inert gases such as air or nitrogen, argon, etc. (non air mediarequire additional configuration）
BGA absorption mode: Negative pressure vacuum suction, automatic induction releasein place
BGA weight: 50-200g(Special specifications can be customized)
Minimum chip spacing: 0.15mm
External Temperature: Sensor6（Expandable）
Machine type: floor type
Net weight: About 950kg
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