Industry Insights 03 Jan 2026 views ( )

YES Announces Leadership Transition, Appoints Rezwan Lateef as CEO

Yield Engineering Systems (YES), a leading provider of high-performance process solutions in the advanced semiconductor packaging market, today announced the appointment of Rezwan Lateef as Chief Executive Officer. Mr. Lateef previously served as President of YES and has been instrumental in driving significant growth, global expansion, and product innovation at the company over recent years.

This leadership transition marks a natural progression for the company, which has surpassed key revenue milestones and is now entering its next phase of scaled expansion alongside top-tier semiconductor and artificial intelligence computing customers.

Rama Alapati, who has served as CEO since 2021, will transition into an advisory role, supporting Mr. Lateef during the handover period to ensure smooth continuity of operations.

Rezwan Lateef said: “Rama played a pivotal role in transforming YES from a promising technology company into a recognized leader in advanced packaging. His dedication and leadership have been central to our transformation. I am deeply grateful for his collaboration and delighted that he will continue supporting me through this transition.”

Under Mr. Lateef’s leadership, YES will continue strengthening partnerships with industry-leading customers and advancing technology solutions targeting the rapidly growing artificial intelligence and high-performance computing markets. Strategic priorities include accelerating development of new systems for next-generation packaging architectures and expanding innovative solutions to help customers meet surging demand in AI and HPC applications.

Nety Krishna, Senior Managing Director at KCK, representing one of YES’s principal investors, said: “We are extremely optimistic about YES’s prospects and remain fully confident in its future. The company has made substantial investments in product development and holds a strong position among key customers in the fast-growing advanced packaging sector. This leadership transition reflects our long-term commitment to supporting YES in its next stage of development.”

Mr. Lateef added: “YES has an outstanding team, a global footprint, and a clear technology roadmap aligned with customer needs. I look forward to leading the company into a new chapter, where we will continue scaling, innovating, and enhancing the value we deliver to the industry.”

The leadership transition is effective immediately.

About YES

YES is a leading supplier of differentiated technologies in materials and interface engineering, serving industry leaders who drive next-generation solutions across sectors including advanced packaging for artificial intelligence and high-performance computing, storage systems, and life sciences. As an advanced equipment manufacturer for wafer and panel-level semiconductor packaging, YES delivers cost-effective, high-volume manufacturing tools. Its portfolio includes critical semiconductor industry equipment such as vacuum curing, coating and annealing tools, fluxless reflow systems, glass via technology, cavity etching, and chemical deposition systems. Headquartered in Fremont, California, USA, YES is rapidly expanding its global operations. For more information, please visit YES.tech.

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